The Internet in Your Pocket – MIDs and WiMAX

Wednesday, January 16th, 2008 at 6:00 PM

TI Auditorium

    

Speaker: Rama K. Shukla

Bio: Dr. Shukla joined Intel in 1979. Previous to his current assignment, Dr. Shukla has held a number of technical and business management positions spanning 28 years of his career with Intel Corporation. These include positions such as Engineering Manager and Centrino® Platform Program Management in Mobility Group, General Manager & Director of the Silicon based Photonics Optical Components business group and various positions ranging from individual technical contributor to group manager/director involving the development of Silicon IC process and associated packaging/interconnect technologies.
Dr. Shukla received his master's degree in solid state chemistry from the Indian Institute of Technology, Kanpur, India & Ph.D. in materials science and engineering from the University of California, Berkeley in 1979. He holds several patents and has published numerous papers related to silicon device processing and assembly technologies. He received IEEE Manufacturing Technology of the Year Award in 2000 for leading IC industry transition to flip-chip laminated package & interconnects technologies at Intel Corporation.

Title: The Internet in Your Pocket – MIDs and WiMAX