Billions of IoT Devices for Everyone

Thursday, September 25th, 2014 at 4:30 PM

TiE SV Conference Center, 2903 Bunker Hill Lane Suite 150, Santa Clara 95054

Chair: MP Divakar (IEEE ComSoc) & Vanessa Zucker (TiE Silicon Valley)
Organizer: MP Divakar (IEEE ComSoc) & Vanessa Zucker (TiE Silicon Valley)

Session Abstract:Things we use every day are getting smarter and helping us not only do things better and faster but also allowing us to do things that were not even possible before. More than just glasses that let one watch online videos, these things are making our homes efficient, helping us avoid disastrous accidents, and assisting in the creation of better-planned city infrastructure. What is possible with today's technology? What is actually possible in the future and what is a pipe dream?

The Santa Clara Valley IEEE Communications Society and Silicon Valley TiE (The Indus Entrepreneurs) are pleased to present the workshop Billions of IoT Devices for Everyone which envisions what the individual can really do with IoT devices through two panel discussions focused on the technology needed and the apps that utilize that technology. Each panelist will have 10 minutes to speak on a specific area of expertise, followed by 20 minutes of moderated discussion and 20 minutes of Q&A.

Speaker: Sam Massih (Session 1 Keynote)

Bio: Director of Wearable Sensors, Invensense

Sam Massih is a semiconductor industry veteran with 18 years of experience in establishing, growing, and managing technology based businesses. His entire career has centered around defining and launching new semiconductor product lines targeted at consumer markets such as mobile, tablet, STB, LCD TV, DSC, and now wearable technologies. Sam's past adventures has taken him to Maxim, NXP (formally Philips Semiconductor), and Semtech where he's been responsible for establishing and growing analog video, LED, and touch interface businesses, respectively. Sam's most recent challenge has been at InvenSense where he is focusing on enabling the next generation of wearable products in the fitness, mobile, and smart bands markets. These markets will require more sensor data to drive better lifestyle decisions, provide day-to-day utility, and generate more valuable data for the cloud services. Mr. Massih holds a MBA from the UC Berkeley Haas School of Business, a MSEE from University of New York, and a BSEE from Pennsylvania State University.

Title: Wearables in the IoT: Market trends, MEMS Solutions and Business models

Abstract: Wearable technologies have only been in the mainstream for 3+ years now and we are already asking the question: "why hasn't it hit the mass market yet"? 2015-01-14

Speaker: Talk/Panel Session

Bio: TI Auditorium

Title: 6:30 PM

Abstract: Better Broadband Transmitters with RF-DACs

Speaker: Rajeev Krishnamoorthy

Bio: Rajeev Krishnamoorthy

Title: Kurt Rentel

Abstract: Kurt R. Rentel received the BS degree in Electrical Engineering from Iowa State University in 1979 and received the MS degree in Electrical Engineering from Colorado State University in 1984. He has been in a range of positions in design, business development, and marketing at Hewlett Packard, Comlinear, National Semiconductor and Maxim Integrated. He is currently Executive Director of Business Management for communication products at Maxim. He has been involved in analog and mixed signal solutions for broadband communications systems throughout his career with a focus on high speed ADCs and DACs.

Bio: 20150113-Ostrem-Rentel-Maxim.pdf

Title: Geir Ostrem

Abstract: Geir S. Ostrem (M89) is leading communications infrastructure IC design at Maxim Integrated, Colorado Springs, Colorado. He received the M.Sc. and Ph. D. degrees in electrical engineering from the Norwegian University of Science and Technology in Trondheim, Norway in 1991 and 1996 respectively. He designed analog CMOS, BiCMOS and bipolar ASICs for a multitude of applications at Nordic VLSI, Trondheim, Norway from 1992-1998, with primary focus on high speed ADCs. From 1998 to 1999, he contributed to an analog front end for ADSL at Globespan Semiconductor, Red Bank, New Jersey as an LSI design project lead. He designed high speed ADCs at Signal Processing Technologies, Colorado Springs, Colorado from 1999 to 2001. Since 2001 he has been with Maxim Integrated, where his main contribution has been the development of RF-DACs, eliminating analog modulators in wired and wireless RF transmitters. Currently, he is an Executive Director of IC Design. His work is focused on digital RF solutions.